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18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing / High-Speed Copper Clad Laminates

JIMA Copper
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    Buy cheap 18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing / High-Speed Copper Clad Laminates from wholesalers
     
    Buy cheap 18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing / High-Speed Copper Clad Laminates from wholesalers
    • Buy cheap 18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing / High-Speed Copper Clad Laminates from wholesalers

    18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing / High-Speed Copper Clad Laminates

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    Brand Name : JIMA
    Model Number : EDCU
    Certification : SGS, ISO,Reach, RoHS
    Price : Negotiation
    Payment Terms : T/T, L/C
    Supply Ability : 1000 Ton per month
    Delivery Time : 5-15 days
    • Product Details
    • Company Profile

    18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing / High-Speed Copper Clad Laminates

    18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing/High-Speed Copper Clad Laminates


    JIMA Copper is doing copper foil of Li-ion battery 4.5um to 14um more than 12 years. and production capacity 150000tons /years.


    Features:


    1,Special silane treatment with high peel strength


    2,Nanoscale treatment of copper nodules


    3,Excellent anti-oxidation and shelf life


    4,Enhanced Bonding Strength


    5,Smooth Surface Finish,High Electrical Conductivity


    6,Improved Flexibility,Resistance to Corrosion


    7,Diverse Thickness and Width Options


    8,It has better etching performance. It can effectively shorten the production process, achieve higher speed and fast micro-


    etching, and improve the qualification rate of printed circuit boards.


    Application:


    1,High Density Interconect(HDI)


    2,High speed digital


    3,Production of high-frequency and high-speed copper clad laminates


    4,Communication electronic equipment (Base station / Server routers, switches)


    5,Computer hardware


    6, PCB board manufacturing


    7, Semiconductor industry


    8, Electromagnetic shielding and heat conduction


    9,Multilayer board;high-frequency board



    Details Package: wooden box

    FAQ:


    Q1: delivery time ?

    A: The general delivery time is 10~15 working days.


    Q2: What's your minimum order quantity?

    A: The MOQ is 10kg.

    Q3. what is your standard width?

    A:
    300mm 500mm 600mm,we accept customization for the width. we can cut it into any size that you demand after pass discussing.

    18μm RTF Reverse Copper Foil Series standard sample digital:


    Specifications standard sample(35 μm)
    
    
    Mechanical Properties
                            
    Ra on matte side Rz
    <2.5 μm
    Tensile strength
    >330 MPa
    Elongation
    >5%
    peel strength(FR4)
    ≥1.5 N/mm(FR4)

    18μm RTF Reverse Copper Foil Series Technical Data Sheet:


    Project
                            
    Unit
                            
    Technical requiremente
                            
    Thickness
                            
    μm
    18
    35
    70
    Unit Area Weight
                            
    g/m2
    145±5
    275±5
    585±5
    Roughness 
                            
    M side Rz
    μm
    ≤3.5
    ≤5.0
    ≤8.0
    S side Rz
    μm
    ≤3.0
    ≤3.0
    ≤3.0
    
    
    Tensile Strength
                            
    25℃
    MPa
    ≥320
    ≥320
    ≥320
    
    
    Elongation
                            
    25℃
    %
    ≥5
    ≥8
    ≥8
    
    
    Peel Strength
                            
    N/mm
    1.2
    1.2
    1.2
    Antioxidant Capacity
                            
    -
    200℃ 40min No oxidation
                            

    Remark: accept customization, Standard Width,100-1440(±1)mm,


    Quality 18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing / High-Speed Copper Clad Laminates for sale
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