1/2 OZ high temperature elongation gray ED copper foil for Epoxy
board
Detail Specification:
. Standard width:1290mm.
. Thickness: 17um,1/2 OZ.
. ID: 76 mm,152 mm.
. purity:99.8%.
Classify:
(HTE-E)-high temperature elongation electrodeposited copper foil.
(LP-E)-low profile electrodeposited copper foil.
(VLP-E)-very low profile electrodeposited copper foil.
what's Application:
.PCB and antenna PCB.
.CCL.
FAQ:
Q4: Can you supply the sample?
A: We can supply samples to check the quality before bulk order
Q5. Do you test all your goods before delivery?
A: Yes, we have 100% test before delivery.
Q6. what is your standard width?
A: 520mm and 620mm,we accept customization for the width. we can
cut it into any size that you demand after pass discussing.
Package:
HTE ED copper foil (high elongation copper foil at high temperature)
| Thickness | um | 9 | 12 | 18 | 25 | 35 | 70 | IPC 4562 4.6.3.1
|
| Area weight | g/m² | 80±1 | 107±3 | 153± | 215±5 | 285±5 | 585±8 | IPC 4562 4.6.3.2 |
| Roughness | (RA) | μm | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | IPC 4562 4.6.9 |
| (RZ) | μm | <6.0 | <6.5 | <8.0 | <9.0 | ≤10.0 | <15 |
Copper≧ | % | 99.8 | IPC 4562 4.6.3.1
|
| Tensile Strength | state normal | Mpa | >300 | >300 | >300 | >300 | >300 | >280 | IPC 4562 4.6.4 |
| state temper (180℃) | Mpa | >15.0 | >18.0 | >18.0 | >18.0 | >18.0 | >18.0 |
| ElongationI | state normal | % | >3.0 | >3.0 | >5.0 | >6.0 | >10.0 | >10.0 | IPC 4562 3.5.3 |
| state temper (180℃) | % | >2.0 | >2.5 | >2.5 | >3.0 | >5.0 | >5.0 |
| Peel strength | N/mm | >1.0 | >1.05 | >1.35 | >1.70 | >1.8 | >2.0 | IPC 4562 4.6.7 |
High temperature oxidation resistance(200℃, 40min) | No color change | Standard |
| Solderability | Good | Standard |
| Solderability | Good | IPC 4562 4.6.12 |
3. Standard Width,1295(±1)mm,May according to the customer request
tailor.
We test the peel strength with FR-4(Tg140) prepreg ,please
reconfirm with your pp.
