LP-S-B/R Low Profile Electrodeposited Electrolytic ED Copper Foil
for FCCL FPC COF LED
Low Profile Electrolytic Copper Foil Black Treatment 105um 70um
50um 35um 25um 12um 9um
Matte side treatment low profile foil in back/red.
Low Profile Electrolytic Copper Foil Balck treatment 105um 70um
50um 35um 25um 12um 9um
Black Low Profile Electrolytic Copper Foil 105um 70um 50um 35um
25um 12um 9um
Features:
1. The treated foil in gray or red
2. High profile with properties of LP-S-B/R suitable for FCCL
3. Grain structure of copper foil leads to high flexibility
4. Excellent etching performance
5. Low profile enables to make fine circuit pattern
Application:
1. Casting and lamination type FCCL
2. Super fine pattern FPC
3. Chip on flex (COF) for LED
Typical properties of LP-S-B/R ED electrolytic copper foil(for FPC
or inner layer of HDI)
Classification
| Unit | Requirement | Test Method |
| Foil Designation | / | | 1 | H | M | 1 | IPC-4562A |
| Nominal thickness | / | 10um | 12um | 1/2 OZ(18um) | 3/4 OZ(25um) | 1 OZ(35um) | IPC-4562A |
| Area Weight | g/㎡ | 98±4 | 107±4 | 153±5 | 228±8 | 285±10 | IPC-TM-650 2.2.12.2 |
| Purity | ％ | ≥99.8 | IPC-TM-650 2.3.15 |
| Foil Profile | Shiny side(Ra) | սm | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 | IPC-TM-650 2.3.17 |
| Matte side(Rz) | um | ≤4.0 | ≤4.5 | ≤5.5 | ≤6.0 | ≤8.0 |
| Tensile Strength | R.T.(23℃) | Mpa | ≥260 | ≥260 | ≥280 | ≥280 | ≥280 | IPC-TM-650 2.3.18 |
| H.T.(180℃) | Mpa | ≥180 | ≥180 | ≥180 | ≥180 | ≥180 |
| Elongation | R.T.(23℃) | ％ | ≥5 | ≥6 | ≥8 | ≥10 | ≥12 | IPC-TM-650 2.3.18 |
| H.T.(180℃) | ％ | ≥5 | ≥6 | ≥7 | ≥8 | ≥8 |
| Peel Strength(FR-4) | N/mm | 0.7 | 0.8 | 1.0 | 1.1 | 1.2 | IPC-TM-650 2.4.8 |
| Ibs/in | 4 | 4.6 | 5.7 | 6.3 | 6.9 |
| Pinholes&porosity | Number | No | IPC-TM-650 2.1.2 |
| Anti-oxidization | R.T.(23℃) | 180days | / |
| H.T.(200℃) | 60 Minutes | / |
1. Standard Width 520mm,max width 1295(±1)mm,May according to the
customer request tailor.
We test the peel strength with PI ,please reconfirm with your pp.
