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Battery ED Ultra Thin Copper Foil , RoHS 25um Copper Thin Sheet Roll

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Battery ED Ultra Thin Copper Foil , RoHS 25um Copper Thin Sheet Roll

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Brand Name :	JIMA
Model Number :	EDCU
Certification :	SGS, ISO,Reach, RoHS
Price :	negotiation
Payment Terms :	T/T, L/C
Supply Ability :	9000 Ton per month
Delivery Time :	5-15 days

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Product Details
Company Profile

Battery ED Ultra Thin Copper Foil , RoHS 25um Copper Thin Sheet Roll

0.025mm Thick ED Copper Foil , Copper Foil 25 micron

Application:transformer, PCB, battery, precisio

Company Information

JIMA has 20 years experience in copper foil industry, more than 27000 tons output yearly to meet the rising market requirement. In PCB, battery and shielding field, our copper foil leads the market as a material supplier. High quality product and sincere service is our fundamental to be existence and developing.

Copper Specification

Product name	ED Copper Foil 25 Micron, Insulated Copper Foil 0.025mm Thick
Copper foil thickness	25um,0.025mm
Copper type	ED Copper Foil for PCB, Li-ion Battery, MRI Room sheilding copper foil ,Insulated
Copper content	≥ 99.9%
Certification	ISO 9001:2008, IPC-4562, RoHS
MOQ	One roll
Cut roll width	Customized
Coil length and weight	on request
Characteristics	High Temperature Elongation, Fine and Uniform Crystal Structure
Payment Term	T/T in advance, Western Union, L/C
Flatness	good flatness close to 100%, without stress or others that can influence the production
Application	transformer, PCB, battery, precisio

ED Copper Foil Typical Properties

Classification			Unit	Requirement				Test Method
Foil Designation			/	H	M	1		IPC-4562A
Nominal thickness			/	1/2 OZ	3/4 OZ	1 OZ		IPC-4562A
Area Weight			g/㎡	150±5	228±8	285±10		IPC-TM-650 2.2.12.2
Purity			％	≥99.8				IPC-TM-650 2.3.15
Foil Profile		Shiny side (Ra)	սm	≤0.4	≤0.4		≤0.4	IPC-TM-650 2.3.17
		Matte side(Rz)	um	≤8	≤10		≤12
Tensile Strength		R.T.(23℃)	Mpa	≥220	≥235		≥280	IPC-TM-650 2.3.18
Elongation		R.T.(23℃)	％	≥2	≥3		≥3	IPC-TM-650 2.3.18
Peel Strength(FR-4)		CEM-1	N/mm	≥1.5	≥1.7		≥2.0	IPC-TM-650 2.4.8
		PTC		≥0.5	≥0.6		≥0.8
Pinholes&porosity			Number	No				IPC-TM-650 2.1.2
Anti-oxidization	R.T.(23℃)		day	180 or customize				/
	H.T.(200℃)		Minutes	60 or customize				/

Copper Feature
1. Lightweight
2. Installed in more MRI Sites Worldwide than any other shield system.
3. Can be used with either a monolithic RF Floor (moisture resistance) or a modular RF Floor.
4. Copper Serves as an eddy current shield for EMI Protection

The Production Flow :

Copper Foil Photos

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